Description

50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm
High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.

PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring Repair

Specification :

• Materials: Tin and lead
• Weight: 50g
• Wire Diameter: 0.3/0.5/0.8/1.0mm
• Flux Content: 2.0(%)
• Melting Point: about 290(°C)
• Type: Rosin Core Solder Wire
• Shape: Small roll type
• Uses: electronic components Welding repair