Description

Amaoe BGA Reballing Stencil For SAMSUNG Exynos EU1 EU2 EU3

Amaoe For Samsung Exynos CPU RAM IC EU1 EU2 EU3 EU4 EU5 BGA Stencil Chip Solder Ball Reballing Pins Tin Plant Net Square Hole. 

Exynos 7885/9820/980/8890/5430/7420/7880/8895/9810/3475/7580/3470/7570 For Samsung CPU BGA TIN Reballing Stencil Solder Template.

Features:
1. Brand New.
Amaoe BGA Reballing Stencil For SAMSUNG Exynos EU1 EU2 EU3 EU4 EU5 
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole

Option:
option 1: Exynos CPU-EU1 0.12mm
option 2: Exynos CPU-EU2 0.12mm
option 3: Exynos CPU-EU3 0.12mm
option 4: Exynos CPU-EU4 0.12mm
option 5: Exynos CPU-EU4 0.15mm
option 6: Exynos CPU-EU5 0.12mm