Description

AMAOE CNC Motherboard Swap Reballing Platform For iPhone 7-16PM

Amaoe iCloud removal BGA reballing stencil platform for iPhone 7-16 Pro Max NAND Flash/CPU/Baseband EEPROM IC tin planting. Amaoe Mbga-IP 30 in 1 BGA reballing platform for iPhone 7/8/X/11/12/13/14/15/16 Pro Max motherboard swap. Amaoe Mbga-IP iPhone BGA tin planting/glue removal stencil with platform. 

Amaoe CNC Board Swap Reballing Platform Kit:
1x Amaoe Magnetic Base.
1x Amaoe positioning plate for iPhone 7/7P.
1x Amaoe positioning plate for iPhone 8/8P/X.
1x Amaoe positioning plate for iPhone XS/XS MAX/XR.
1x Amaoe  positioning plate for iPhone 11/11Pro/11 Pro Max.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 7/7P.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 8/8P/X.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone XS/XS MAX/XR.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 11/11Pro/11 Pro Max.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 12 series.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 13 series.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 14 series.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 15 series.
1x Amaoe NAND/CPU/EEPROM IC reballing stencil for iPhone 16 series.