Description

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table

HMT-X1/ZJ-X1 multi-functional motherboard layered chip glue removal heating table for iPhone 16/15/14/13/12/11/X PCB layering tinning repair and chip glue removal. HMT-X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair.  

Features:
1. Temperature control imported from Germany, rapid heating.
2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up.
3. Motherboard delamination / chip degumming, separation preheating / tinning.
4. Self-contained motherboard / chip fixing, compact and light.
5. Maximum temperature 260 degrees, free temperature adjustment, uniform heating.
6. Aluminum alloy panel, synthetic stone insulation, ceramic heating pad patented technology.

Specification:
Product Model: HMT-X1.
Color options: Space Gray.
Working voltage: 110V/220V.
Maximum temperature: 260℃.
Product size: 170*125*75H.
Packing size: 190*160*120H.
Outer box size: 810*206*500H.
Product weight: 0.85kg.
FCL weight: 18.5kg.

Package includes:
1 x Heating Table.
1 x Power Cable.