Description

Leaded Tin Solder Balls for BGA Reballing Soldering Balls Particle

250K Leaded Tin Solder Balls 0.15/0.2/0.35/0.45/0.55/0.65mm…, Universal BGA Reballing Soldering Solder Balls for GPU CPU IC Chip PCB Soldering Particle Accessories

Leaded Tin Solder Balls for BGA Reballing Soldering Balls Accessories

This soldering balls set consists of 12 small containers/bottles, each with 250000 / 100000 / 25000 soldering balls with a diameter of 0.15 to 0.889 mm.

Type (Optional) Quantity Size Weight:  250000 / 100000 / 25000 particles / Bottle

Specification:

0.15 mm soldering balls BGA
0.2 mm soldering balls BGA
0.25 mm soldering balls BGA
0.3 mm soldering balls BGA
0.35 mm soldering balls BGA
0.4 mm soldering balls BGA
0.45 mm soldering balls BGA
0.5 mm soldering balls BGA
0.55 mm soldering balls BGA
0.6 mm soldering balls BGA
0.64 mm soldering balls BGA
0.76 mm soldering balls BG
100000*0.889 mm soldering balls BGA

Pleast note: the soldering tin balls can only be sent out by special post.