Description

MECHANIC XG-20 50 250 BGA Solder Flux Paste Welding Tin Cream
Mechanic 183℃ solder paste for motherboard CPU chips soldering repair. Mechanic XG-30 XG-40 XG-50 XG-Z40 Soldering Flux Paste BGA Solder Paste Soldering Tin Cream. Mechanic special solder paste flux for BGA chip soldering repair.

Parameters:
Melting Point: 183℃
Alloy: Sn63/Pb37
Storage conditions: 0-10℃, 12 months

Models(183℃):
XG-30 16g
XG-40 30G
XG-50 35G
XG-Z40 35G

Application: Suit for PCB and small components welding.

Note: solder paste flux can only be sent out by special post mail.

Package List:

1x 183℃ Soldering Paste