Description

QianLi 007 008 009 011 012 Blade IC Pry Glue Removal Knife Kit

QianLi 007 008 009 011 012 Blade Glue Removal BGA CPU IC Pry Knife Set. Professional Mobile Phone Repair Disassembly Scraper Tool For SMD BGA Motherboard CPU Chip Disassembling Glue Cleaning Removing, ect. 

Option:
1. Qianli 007 Blade kit.
2. Qianli 008 Blade kit.
3. Qianli 009 Plus blade kit.
4. Qianli 011 Blade kit.
5. Qianli 012 iHilt handle. 

Features:

1. The side glue cleaning tool is suitable for iPhone motherboard CPU NAND baseband chip edge glue removing.
2. When the CPU tin melting point, the blade can be directly inserted into the CPU, the CPU is so relaxed and safe removed.
3. Equipped with a sharp crescent blade, used to remove glue from hard disk and CPU of your phone effectively.
4. The handle is designed with a screw texture that enhances grip strength, which can provide you with friction during work, thereby playing a non-slip effect.

007 item Included : 

• 1* Double head knife handle
• 3* Moon knife

008 item Included: 

• 1* Double head knife handle
• 3* Crescent Knife

009 item Included: 

• 1* Double head knife handle
• 12* UV glue removing knife

011 item Included:

• 16pcs x Cooper Blades
  
• 1* Double head knife handle