Description

QianLi Bumblebee BGA Reballing Stencils For iPhone 6-15 Pro Max
QianLi ToolPlus Bumblebee 2D BGA Reballing Stencils for iPhone 6-15 Pro Max motherboard CPU Nand chip soldering repair. Qianli Bumblebee square holes round angle BGA stencils stainless steel mesh for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11 Pro/11 Pro Max/12/12 Pro/12 mini/12 Pro Max/13/13mini/13 Pro Max/14/ 14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max.

Features:
1. Qianli ToolPlus Bumblebee iPhone series stencil.
2. Sturdy, precise and durable over time.
3. Easier to use even more precisely.
4. Square holes round angle BGA stencils, sliver.
5. For iPhone 6-15 Pro Max A8-A17 Pro CPU.