RF4 0.3-1.0mm Sn63% Rosin Core Tin Solder Wire For Phone BGA Repair RF4 RF-106A 0.6mm 108A RF-0.8mm 100g / RF-203D 0.3mm RF-204D 0.4mm RF-206D 0.6mm RF-208D 0.8mm RF-210D 1.0mm 200g Sn63% Lead-Free Rosin Core Solder Tin Wire. RF4 BGA desoldering wire for mobile phone motherboard SMD PCB welding repair tool.
Features:
Environmentally friendly and lead-free.
Good wettability, conductivity, and resistance to heat fatigue.
The solder joint is smooth and it can effectively resist oxidation.
Fast spreading speed even with small holes.
The solder wire is wound up evenly with a roll for easy sorting and preservation.
. Options:
Option1: RF4 RF-106A 100g 0.6mm
Option2: RF4 RF-108A 100g 0.8mm
Option3: RF4 RF-203D 200g 0.3mm
Option4: RF4 RF-204D 200g 0.4mm
Option5: RF4 RF-206D 200g 0.6mm
Option6: RF4 RF-208D 200g 0.8mm
Option7: RF4 RF-210D 200g 1.0mm
How to Use:
Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.
Remove both the desoldering wick and the soldering iron tip from the PCB after the solder has been absorbed.
Cut off the used section of the wick using nippers.
Repeat steps 1,2 and 3 if the solder is not removed completely. Absorbability may differ depending on the type of solder. Sn63% and 60% (tin content) have good absorbability.
Caution:
To prevent injury, do not touch the wicks directly while desoldering. Hold the case, or use tweezers, etc.
Do not force the tip against the desoldering wick, do not heat for more than 5 seconds to avoid hurting yourself or damaging parts and PCB.
Warning:
Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns.
To avoid fire, never use a soldering iron and desoldering wick around combustibles or in an explosive environment.
