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WL 0.1mm BGA Reballing Stencils Kit For iPhone A8-A16 CPU Online Sale

Original price was: $7.99.Current price is: $3.20.

SKU: US-5597052305565 Categories: , Tag:

Description

WL 0.1mm BGA Reballing Stencils Kit For iPhone A8-A16 CPU
WL 0.1mm BGA Reballing Stencil for iPhone Baseband NAND A8-A16 CPU soldering repair, 0.1mm BGA reballing stencil solder template for iPhone A16 A15 A14 A13 A12 A11 A10 A9 A8 CPU Baseband NAND, iPhone A8-A16 CPU repair template, Stainless steel reballing soldering net for iPhone X-14promax baseband and NAND chip.

WL 0.1mm BGA Reballing Stencil Template For iPhone Baseband / NAND / A8-A16 CPU Upper / Lower

[ Option BGA Reballing Stencil Package ] :
Suggest Choose: BGA Reballing Stencil + Black Positioning Mold

(Choose different package ), and just 1pcs Aluminum Mold Base, easy for your working, and also save money

  • Option 1: iPhone 5/5S Baseband and NAND
  • Option 2: iPhone 6/6P Baseband and NAND
  • Option 3: iPhone 6S/6SP Baseband and NAND
  • Option 4: iPhone 7/7P Baseband and NAND
  • Option 5: iPhone 8/8P/X Baseband and NAND
  • Option 6: iPhone XS MAX XR Baseband and NAND

  • Option 7: A6 CPU upper — out of stock
  • Option 8: A7 CPU Upper
  • Option 9: A6 / A7 CPU Lower
  • Option 10: A8 CPU Upper
  • Option 11: A8 CPU Lower
  • Option 12: A9 CPU Upper
  • Option 13: A9 CPU Lower
  • Option 14: A10 CPU Upper
  • Option 15: A10 CPU Lower
  • Option 16: A11 CPU Lower
  • Option 17: A12 CPU Lower

[ Optional Aluminum Mould Base ] : it is universal, can fit with any Black Positioning Mold,

  • Option 1: Included base
  • Option 2: Without base

Optional Positioning Mold (Black): Not univeral, can’t working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.

  • Option 1: Included Positioning Mold
  • Option 2: Without Positioning Mold

There have 3 parts section, BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)

BGA Reballing Stencil + Black Positioning Mold

Full Set: BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)

0.1 – 0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working, it is the top quality BGA Reballing Stencil for iPhone Baseband CPU and NAND, A10 / A9 / A8 CPU..

WL top quality fast speed BGA reballing solder template stencil

Demo video : http://v.youku.com/v_show/id_XMTg5MDA1NDkyOA==.html

Additional information

Package

A8 CPU, A9 CPU, A10 CPU, A11 CPU, A12 CPU, A13 CPU, A14 CPU, A15 CPU, A16 CPU

Base

Without Base, With Base