XZZ Motherboard Layered Testing Frame For iPhone X-16 Pro Max Online now
$79.99 Original price was: $79.99.$24.00Current price is: $24.00.
Description
XZZ Motherboard Layered Testing Frame For iPhone X-16 Pro Max
XINZHIZAO Motherboard Layered Test Fixture For iPhone X 11 12 13 14 15 16 Series Middle layer Logic Board Function Testing. XZZ iSocket motherboard test fixture frame for testing iPhone X-16 Pro Max motherboard double layer function before installation.
Option:
1. XZZ FIX-XSM motherboard test fixture for iPhone X/XS/XS MAX.
2. XZZ FIX-11PM motherboard test fixture for iPhone 11/11Pro/11 Pro Max.
3. XZZ FIX-12 motherboard layered test stand for iPhone 12/12 mini/12Pro/12 Pro Max.
4. XZZ FIX-13 motherboard layered test frame for iPhone 13/13 mini/13Pro/13 Pro Max.
5. XZZ 14 Series motherboard test racks for iPhone 14/14 Plus/14Pro/14 Pro Max.
6. XZZ 15 Series motherboard fixture: SIM Card version for iPhone 15/15Plus/15Pro/15 Pro Max.
7. XZZ 15 Series motherboard fixture: eSIM US version for iPhone 15/15Plus/15Pro/15 Pro Max.
8. XZZ 16 Series 4-in-1 motherboard test fixture for iPhone 16/16 Plus/16 Pro/16 Pro Max.
Please note(XZZ 15 Series):
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. Import high-quality pure copper probes (0.5mm probes)
2. High Alignment accuracy
3. for iPhone X-16 pro max.
4. CNC Processing Technology
5. Spring button buckle designed, simple operation, fast rebound, timely feedback, easy press.
6. Suitable for iPhone X-16 pro max..
7. Mini design, easy to carry.
8. Advanced inspection to avoid any damage because of repeated disassembly and installation
Operation:
1. Place the motherboard lower layer on the test fixture
2. Place Place the test pin plate corresponding to the motherboard
3. Place the motherboard lower layer on the test pin board
4. Put every component together, then fasten the buckles on both sides and start to test it.
Additional information
Option | 3 IN 1 For X/XS/XSM, 3 IN 1 For 11 Series, 4 IN 1 For 12 Series, 4 in 1 For 13 series, 4 in 1 For 14 series, XZZ 15 series SIM Card version, XZZ 15 series eSIM version, 4 IN 1 for 16 Series |
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